With ALD, ultra-thin films are created through a precise, sequential exposure of a substrate to gas phase precursors, resulting in controlled layer-by-layer deposition with atomic proportions and pin-hole free morphology conformal to the substrate\'s shape. ALD finds...

Vertical laminar flow cabin model AV30/70 from Telstar equipped with a spin coater SUSS LabSpin6 BM Bench mounted system for two-inch wafers or small rectangular substrates. Speed: 100 - 8.000 rpm, acceleration 4.000 rpm/sec and spinning time: 1 s up to 999 s

Cleanroom class ISO 7 with a surface of 80 m2. Several instruments are available inside: Electron-beam lithography, Laser writer optical lithography, ellipsometry, UHV evaporators, Plasma ICP-RIE dry etching, Sputtering, wire bonder and optical microscope.

Creality Ender 3S1 3D printer with FDM (Fused Deposition Modeling) technology with a printing volume of 220 x 220 x 270 mm. It can print with a resolution of 160 µm on the Z axis and 150µm on the XY axis. It is equipped with a printing bed that can be heated to up to 100oC. It supports the most...

Sentech SE801 spectroscopic ellipsometer. Wavelength: 190nm -1100 nm, Xe Lamp, with fixed angle at 70 degrees.

Evaporation system is formed for two independent UHV chambers with a base pressure of 10-10 mbar. One of them is equipped with an e-beam evaporation source, which allows the deposition of metals and metal in substrates up to 51 cm diameter. The second chamber is for molecular materials...

The QE-R system allows the measurement of EQE, IPCE, IQE and RS, accurately and quickly. This allows studying different device architectures, their losses, band gaps, among others. The system...

Formlab Form 3+ printer with LFS (Low Force Stereolithography) technology with a printing volume of 144.78 x 144.78 x 185.42 mm. It can print pieces with a resolution between 25 -300µm on the Z axis and 25µm on the XY axis in thirty different materials.

This vacuum chamber allows us to sublime materials in high vacuum (10^-6 mbar), which are deposited homogeneously as films into...

Sentech ICP-RIE 500-302 etching tool. Equipped with a vacuum load-lock for samples up to 100 mm diameter. The available gases for processing are: H2, Ar, O2, SF6, and C4F8